| 1. | Ultrathin wafer level chip size package technology 超薄型圆片级芯片尺寸封装技术 |
| 2. | Progress and application for mems packaging technologies 封装技术的发展及应用 |
| 3. | Csp causes the revolution of memory chip package technology 引发内存封装技术的革命 |
| 4. | Advances in food antimicrobial packaging technologies 食品抗菌包装技术进展 |
| 5. | Wlcsp wafer - level chip scale packaging technology 晶圆片级芯片规模封装技术 |
| 6. | Optoelectronic assembly and packaging technology 光电子学总装和包装工艺学 |
| 7. | The development of high density packaging technology 高密度封装技术的发展 |
| 8. | Preliminary discussion on lead - free packaging technology 无铅组装技术浅析 |
| 9. | The development of memory chip package technology 内存芯片封装技术的发展 |
| 10. | Wafer - level packaging technology and application 圆片级封装技术及其应用 |